Technique for testing interconnections between electronic components
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United States of America Patent
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Jan 13, 2009
Grant Date -
Nov 2, 2006
app pub date -
Apr 28, 2005
filing date -
Apr 28, 2005
priority date (Note) -
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Abstract
A technique for testing interconnections between electronic components is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for testing interconnections between electronic components. The method may comprise sending a command from a test controller to a plurality of electronic components via a first communication path, wherein the command comprises an instruction for one or more of the plurality of electronic components to transmit a recognizable data pattern to the test controller via a second communication path. The method may also comprise isolating a failure in the first communication path based upon the recognizable data pattern not being transmitted to the test controller via the second communication path.
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