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United States of America Patent
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Jan 10, 2023
Grant Date -
Jul 23, 2020
app pub date -
Dec 17, 2019
filing date -
Jan 17, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A package has a package body formed by stacked insulating layers and having a front surface including a mounting area, a back surface and a side surface; a plurality of hollow portions arranged so as to be adjacent to each other on the front surface of the package body; a plurality of electrode pads individually placed on respective bottom surfaces of the hollow portions; and a partition wall formed by at least one insulating layer that forms the package body and having protruding banks at its both edge sides. Surfaces of the electrode pads are located at a lower position with respect to the front surface of the package body. The hollow portions are arranged at opposite sides of the partition wall. The electrode pads are electrically connected to respective conductor layers that are formed on the back surface and/or the side surface of the package body.
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