Manufacturing method for capacitor unit by cutting

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11211203
APP PUB NO 20200143992A1
SERIAL NO

16518927

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Abstract

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A capacitor unit and a manufacturing method thereof are provided. The manufacturing method includes the following steps. An isolation layer is formed on a substrate. A first capacitor stacked structure and a second capacitor stacked structure are formed on the isolation layer. Electrode connectors are formed on the first capacitor stacked structure and the second capacitor stacked structure. The electrode connectors are exposed, so that the electrode connectors, the first capacitor stacked structure, the second capacitor stacked structure, the isolation layer, and the substrate are combined to form a capacitor integrated structure, wherein the isolation layer electrically isolates the substrate from the first capacitor stacked structure and the second capacitor stacked structure. The capacitor integrated structure is cut to form a first capacitor unit and a second capacitor unit separated from each other.

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Patent Owner(s)

  • POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Shih-Hao Hsinchu, TW 10 32
Lin, Wei-Yu Hsinchu, TW 28 32

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