Apparatus for thermally processing semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Sep 16, 1999
filing date -
Mar 25, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for thermally processing a semiconductor wafer includes a susceptor to support the wafer, a heater arrangement to differentially heat the wafer and provide a temperature distribution on said wafer, a radiation thermometer for measuring the temperature distribution, and means for controlling and varying the temperature distribution. The heater arrangement particularly includes a first heater to heat an edge of the wafer, around a second heater to heat a center area of the wafer. With this apparatus, the rate of change of the temperature and the temperature distribution of the wafer can be controlled within tolerable limits to avoid slip line generation. Also, the relative stress state of the wafer edge and the wafer center can be influenced by differential heating of the edge and the center.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully