High fiber count undersea cable

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11977267
APP PUB NO 20220283397A1
SERIAL NO

17676143

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed are approaches for forming a semiconductor device. In some embodiments, a method may include providing a patterned hardmask over a substrate, and providing, from an ion source, a plasma treatment to a first section of the patterned hardmask, wherein a second section of the patterned hardmask does not receive the plasma treatment. The method may further include etching the substrate to form a plurality of fins in the substrate, wherein the first section of the patterned hardmask is etched faster than the second section of the patterned hardmask.

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Patent Owner(s)

  • SUBCOM, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rue, Ralph J Barnegat, US 3 12
Spalding, Marsha Ann Hampton, US 3 2

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