Imide-urethane resin, photosensitive resin composition including the same and cured product
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United States of America Patent
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Aug 24, 2010
Grant Date -
Oct 30, 2008
app pub date -
Oct 5, 2006
filing date -
Oct 7, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
[PROBLEMS] To provide a photosensitive resin composition which has excellent photosensitivity and gives a cured product reduced in warpage and excellent in flexing properties, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc.[MEANS FOR SOLVING PROBLEMS] A urethane resin (A) soluble in aqueous alkali solutions and curable with active energy rays which is obtained by reacting a diisocyanate compound (a) with a tetrabasic acid dianhydride (b) to obtain a compound (E), reacting the compound (E) with a hydroxylated compound (c) having an unsaturated group and optionally with a hydroxylated compound (d) other than the compound (c) to obtain a compound (F), and further reacting hydroxy groups of the compound (F) with a diisocyanate compound (e).
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