Semiconductor device package with integrated heat spreader
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United States of America Patent
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Mar 2, 2010
Grant Date -
May 3, 2007
app pub date -
Nov 2, 2006
filing date -
Nov 2, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The die may be silicon or GaN based MOSFETs or integrated circuits or a mixture thereof. The tops of the die are closely spaced from the interior of the cap and the volume is filled with a thermally conductive, electrically insulating plastic encapsulant. One die can be connected to the clip as well as the lead frame and the other may be an IC die insulated from the clip.
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