Method and apparatus for packaging circuit devices
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United States of America Patent
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Jan 11, 2011
Issued Date -
N/A
app pub date -
May 19, 2009
filing date -
Mar 8, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A hermetically sealed package includes a lid (14) hermetically bonded to a wafer or substrate (12), with a chamber therebetween defined by a recess (16) in the lid. A circuit device (26) such as MEMS device is provided within the chamber on the substrate. A plurality of vias (41-46) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.
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