Systems and methods for machine learning based fast static thermal solver

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United States of America Patent

PATENT NO 11853661
APP PUB NO 20220277120A1
SERIAL NO

17664241

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Abstract

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Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network. The trained predictor can be used to determine a temperature rise and then can be appended to a system level thermal profile of the IC to generate a detailed thermal profile of the IC.

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Patent Owner(s)

Patent OwnerAddress
ANSYS INC2600 ANSYS DRIVE CANONSBURG PA 15317

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Norman Fremont, US 29 124
Chuang, Wen-Tze Yilan County, TW 5 0
Kumar, Akhilesh Milpitas, US 70 976
Li, Ying-Shiun Pleasanton, US 5 1
Pan, Hsiming San Jose, US 6 1
Srinivasan, Karthik Cupertino, US 49 441
Wen, Jimin Pleasanton, US 8 1
Xia, Wenbo Milpitas, US 4 0
Yang, En-Cih New Taipei, TW 4 0
Zhu, Deqi San Jose, US 12 6

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