Routing structure

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United States of America Patent

PATENT NO 11929331
APP PUB NO 20230121445A1
SERIAL NO

18067728

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kan, Hao-Tien Hsinchu, TW 8 2
Lee, Meng-Xiang Yunlin County, TW 17 25
Lin, Chin-Shen Taipei, TW 55 112
Lo, Wan-Yu Taoyuan County, TW 28 155
Wang, Chung-Hsing Hsinchu County, TW 214 1257
Yang, Kuo-Nan Hsinchu, TW 131 879

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