Semiconductor structure and preheating method thereof

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United States of America Patent

PATENT NO 11862223
APP PUB NO 20210366531A1
SERIAL NO

17396686

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Abstract

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A semiconductor structure and a preheating method thereof are provided. The semiconductor structure includes: a storage chip; a temperature detection unit configured to detect a temperature of the storage chip before the storage chip initiates; and a control chip configured to: before the storage chip initiates, heat the storage chip and determine whether the temperature detected by the temperature detection unit reaches a specified threshold; and if the temperature reaches the specified threshold, control the storage chip to initiate. When the semiconductor structure provided in the present invention works at a low temperature, the storage chip may be heated to the specified threshold, thereby preventing an increase of the resistances on the bit line, the word line, and the metal connection line in the storage chip, and improving the performance of read/write operations of the memory.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INCHEFEI CITY ANHUI 230601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ning, Shuliang Hefei, CN 18 12

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