Nozzle for soldering apparatus
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United States of America Patent
Stats
-
Jan 26, 2010
Grant Date -
Aug 15, 2002
app pub date -
Jan 10, 2002
filing date -
Jan 10, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a dip soldering process, solder is pumped through a nozzle outlet. Leads of a component on a circuit board are dipped into the surface of the flowing solder to solder the leads to a track on the underside of the circuit board. To prevent solder bridging between the leads, a plate is provided below the solder surface, and passes between the leads. When withdrawing the leads from the solder, the solder surface is dropped to the level of the plate, so that excess solder is drawn away from the leads, preventing solder bridging between the leads. Member may be movable to rise through the solder surface as the circuit board is raised away from the surface.
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