Method and system for wafer quality predictive modeling based on multi-source information with heterogeneous relatedness
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 3, 2015
Grant Date -
Apr 17, 2014
app pub date -
Oct 15, 2012
filing date -
Oct 15, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention generally relates to the monitoring and controlling of a semiconductor manufacturing environment and, more particularly, to methods and systems for virtual meteorology (VM) applications based on data from multiple tools having heterogeneous relatedness. The methods and systems leverage the natural relationship of the multiple tools and take advantage of the relationship embedded in process variables to improve the prediction performance of the VM predictive wafer quality modeling. The prediction results of the methods and systems can be used as a substitute for or in conjunction with actual metrology samples in order to monitor and control a semiconductor manufacturing environment, and thus reduce delays and costs associated with obtaining actual physical measurements.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully