Anisotropic conductive material and method for manufacturing same
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United States of America Patent
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Feb 2, 2016
Grant Date -
May 30, 2013
app pub date -
Nov 30, 2011
filing date -
Dec 2, 2010
priority date (Note) -
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Abstract
The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.
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