Semiconductor wafer testing system and related method for improving external magnetic field wafer testing

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United States of America Patent

PATENT NO 11506706
SERIAL NO

17126222

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Abstract

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In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-Yang Hsinchu, TW 120 1430
Chiang, Tien-Wei Taipei, TW 53 205
Chuang, Harry-Hak-Lay Zhubei, TW 357 2384
Shih, Meng-Chun Hsinchu, TW 22 29
Wang, Chia Yu Hsinchu, TW 13 84
Wang, Ching-Huang Pingjhen, TW 27 54

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