Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

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United States of America Patent

PATENT NO 11487201
SERIAL NO

16498139

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Abstract

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A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

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Patent Owner(s)

Patent OwnerAddress
HD MICROSYSTEMS LTD4-25 KORAKU 1-CHOME BUNKYO-KU TOKYO 112-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asada, Akira Hitachi, JP 10 108
Enomoto, Tetsuya Hitachi, JP 42 321
Kawamori, Takashi Tokyo, JP 50 315
Koibuchi, Yukari Hitachi, JP 2 1
Saito, Nobuyuki Hitachi, JP 54 738
Tsuchiya, Etsuharu Tokyo, JP 1 1
Yoshizawa, Atsutaro Hitachi, JP 4 1

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