Thermal managed interconnect system for a circuit board
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United States of America Patent
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-
Jul 31, 2007
Grant Date -
Mar 2, 2006
app pub date -
Aug 24, 2004
filing date -
Aug 24, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.
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