Method of forming an EM protected semiconductor die

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9299664
APP PUB NO 20110175225A1
SERIAL NO

12689137

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Abstract

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In one embodiment, a semiconductor die is formed to have sloped sidewalls. A conductor is formed on the sloped sidewalls.

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Patent Owner(s)

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carney, Francis J San Tan Valley, US 122 1027
Grivna, Gordon M Mesa, US 225 2580
Seddon, Michael J Gilbert, US 174 1077

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