Thermal head for thermal recording or thermal transfer recording and method of manufacturing the same
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United States of America Patent
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Jun 27, 1995
Grant Date -
N/A
app pub date -
Nov 24, 1992
filing date -
Nov 26, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
A thermal head for thermal recording or thermal transfer recording and a method of manufacturing the head. The head has a heat sink having an upper surface, a heating element substrate, disposed on the upper surface of the heat sink, having a projected convex portion on which an array of heating resistor elements are arranged, an electrical structure mounted on the same side as that of the upper surface of the heat sink and electrically connected to the heating resistor elements, and a protection structure for mechanically protecting the electrical structure. The substrate is constituted such that the height of the substrate from the surface of the heat sink is higher than the height of the protection structure, and the height of the projected convex portion is equal to or more than 0.6 mm.
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