Method for manufacturing an electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11361998
APP PUB NO 20210066127A1
SERIAL NO

16904659

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Abstract

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A method for manufacturing an electronic device is provided. The method includes the following steps: providing a first mother substrate including a plurality of first substrate areas; performing a first half-cutting step on the first mother substrate to produce a first crack to define the plurality of first substrate areas; disposing a first optical film on the first mother substrate having the first crack, wherein the first optical film has a first cutting region corresponding to the first crack; performing a first cutting step in the first cutting region of the first optical film; and separating the plurality of first substrate areas to form a plurality of first substrates.

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Patent Owner(s)

  • CHIMEI INNOLUX CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liang, I-Chang Miao-Li County, TW 9 4
Lin, Chien-Lin Miao-Li County, TW 1 0
Ting, Chin-Lung Miao-Li County, TW 131 405

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