Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover

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United States of America Patent

PATENT NO 11156409
SERIAL NO

16747059

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Importance

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Abstract

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Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bunt, Jay A Esopus, US 14 23
Lewison, David J LaGrangeville, US 9 13
Molinelli, Acocella Joyce E Poughquag, US 7 20
Pompeo, Frank L Redding, US 47 900
Zhang, Hongqing Hopewell Junction, US 12 19
Zitz, Jeffrey Allen Poughkeepsie, US 17 237

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