Metal slurry coatings on substrates, and related articles
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United States of America Patent
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Sep 2, 2003
Issued Date -
N/A
app pub date -
Jan 16, 2002
filing date -
Aug 23, 1999
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Abstract
A method for forming a metal-containing layer on a substrate is disclosed. A slurry of the metal is first deposited on the substrate; followed by heating to remove volatile material from the slurry, and to form a layer of the metal. In another embodiment, a slurry of aluminum is deposited over the slurry of the metal, before or after the metal has been heat-treated to some degree. A diffusion heat treatment results in a coating which includes the noble-metal aluminide compound. Related articles are also disclosed.
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