Multi-piece board and fabrication method therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8378237
APP PUB NO 20100118504A1
SERIAL NO

12537713

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Abstract

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A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.

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Patent Owner(s)

  • IBIDEN CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Yasushi Ogaki, JP 93 669

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