Embedded substrate heat sink for bottom side cooling

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11830783
SERIAL NO

16600107

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Abstract

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Embodiments include semiconductor packages. A semiconductor package include a high-power electronic component and an embedded heat spreader (EHS) in a package substrate. The EHS is adjacent to the high-power electronic component. The semiconductor package includes a plurality of thermal interconnects below the EHS and the package substrate, and a plurality of dies on the package substrate. The thermal interconnects is coupled to the EHS. The EHS is below the high-power electronic component and embedded within the package substrate. The high-power electronic component has a bottom surface substantially proximate to a top surface of the EHS. The EHS is a copper heat sink, and the high-power electronic component is an air core inductor or a voltage regulator. The thermal interconnects are comprised of thermal ball grid array balls or thermal adhesive materials. The thermal interconnects couple a bottom surface of the package substrate to a top surface of a substrate.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BLVD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Je-Young Tempe, US 64 344
Mani, Divya Chandler, US 7 23
Uppal, Aastha Chandler, US 17 24

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