Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips
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United States of America Patent
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Jul 5, 2011
Grant Date -
Oct 8, 2009
app pub date -
Jun 8, 2009
filing date -
Sep 22, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.
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