Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material
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United States of America Patent
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-
Jan 4, 1994
Issued Date -
N/A
app pub date -
Jul 1, 1992
filing date -
Mar 14, 1988
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
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