Pressure-sensitive adhesive having excellent heat-resistance, adhesive sheet using it, and method for producing those

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United States of America Patent

PATENT NO 5462977
SERIAL NO

08181877

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Abstract

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A pressure-sensitive adhesive having excellent heat resistance, comprising a photopolymerization product of a composition comprising; a) 100 parts by weight of a monomer mixture comprising from 70 to 100% by weight of a (meth)acrylic acid alkyl ester having from 2 to 14 carbon atom on the average in the alkyl moiety and from 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the (meth)acrylic acid alkyl ester, b) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, and c) from 0.01 to 4 parts by weight of a photopolymerization initiator, wherein a content of the solvent-insoluble components is at least 60% by weight and a remaining amount of the unreacted monomers is less than 5,000 ppm.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moriyama, Takaaki Osaka, JP 25 152
Yoshikawa, Takao Osaka, JP 29 191

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