Mitigation of physical impact-induced mechanical stress damage to printed circuit boards
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United States of America Patent
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Oct 17, 2023
Grant Date -
Mar 2, 2023
app pub date -
Oct 14, 2022
filing date -
Oct 13, 2022
priority date (Note) -
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Abstract
This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.
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