Nonlinear image distortion correction in printed circuit board manufacturing
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United States of America Patent
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Dec 26, 2000
Grant Date -
N/A
app pub date -
Jul 6, 1999
filing date -
Jul 6, 1999
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Abstract
The present invention relates to a process for the fabrication of multilayer articles having electrical connections between conductor patterns on at least two layers of the multilayer article. The process comprises at least the steps of: a) using an initial set of image data describing a first article or layer having a conductor pattern thereon, forming the first article or layer having a pattern of conductive material thereon; b) taking data of an image of the pattern of conductive material on the first article or layer; c) determining from the image of the pattern of conductive material on the first article or layer the relative location of sites within the pattern of conductive material on said first article or layer that are to be connected to sites on a pattern of conductive material on at least a second layer having conductor patterns thereon; and thereafter performing steps selected from the group consisting of: I) modifying the initial set of image data for the first article or layer to make corrections for each conductive site within the pattern of conductive material and producing a corrected set of image data; II) modifying an initial set of data for at least a second layer having sites within a pattern of conductive material that are to be connected to sites on the first article or layer, said modifying be based upon a comparison of the initial set of image data for the second layer and image data taken in step b) of said first article or layer, and producing a corrected set of image data for the second layer; III) modifying an initial set of data for a second layer having sites within a pattern of conductive material that are to be connected to sites on another layer, the modifying be based upon a comparison of the initial set of image data for the second layer and image data taken of a manufactured second layer, and modifying the initial set of image data for the first article or layer to make corrections for each conductive site within the pattern of conductive material, thereby producing a corrected set of data for at least the first article or layer and the second layer; and IV) modifying an initial set of data for a number of layers, each layer having sites within a pattern of conductive material that are to be connected to sites on another layer, the modifying being based upon a comparison of initial sets of image data for each of the number of layers and image data taken of a manufactured layer for each of the number of layers, and modifying the initial set of image data for each of the number of layers to make corrections for each conductive site within a pattern of conductive material within each of the number of layers, thereby producing a corrected set of image data for each of the number of layers; and then manufacturing at least one layer having conductive sites therein using a corrected set of data for manufacturing the at least one layer.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- KODAK I L, LTD.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Atiya, Yossef | Maccabim, IL | 65 | 1828 |
Taff, Itzhak | Yavne, IL | 6 | 40 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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