Semiconductor package structure and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11837526
APP PUB NO 20200402892A1
SERIAL NO

16450657

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Abstract

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A semiconductor structure includes a molding compound having a first surface and a second surface opposite to the first surface, a passive device component disposed in the molding compound, a via penetrating the molding compound from the first surface to the second surface, a first connection structure disposed over the first surface of the molding compound and electrically coupled to the passive device component, and a second connection structure disposed over the second surface of the molding compound. The first connection structure and the second connection structure are electrically coupled to each other by the via.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yang-Che Hsin-Chu, TW 30 88
Liang, Victor Chiang Hsinchu, TW 101 254
Lin, Chen-Hua Yunlin County, TW 50 241
Liu, Chwen-Ming Hsinchu, TW 35 359
Tseng, Huang-Wen Hsinchu County, TW 29 91

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