Method and system for chip-to-package interconnection
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United States of America Patent
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Oct 11, 2005
Grant Date -
Dec 2, 2004
app pub date -
May 28, 2003
filing date -
May 28, 2003
priority date (Note) -
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Abstract
According to one embodiment of the invention, a method includes providing a semiconductor chip, providing a substrate, forming a plurality of cantilevered springs outwardly from either the semiconductor chip or the substrate, engaging the cantilevered springs with respective contact pads on either the semiconductor chip or the substrate with a fixture, encapsulating the semiconductor chip and cantilevered springs with a molding, and curing the molding.
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