Surface mount technology to via-in-pad interconnections
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United States of America Patent
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Aug 9, 2005
Grant Date -
Jun 24, 2004
app pub date -
Dec 20, 2002
filing date -
Dec 20, 2002
priority date (Note) -
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Abstract
Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher melt temperature than the reflow temperature of the first interconnect material is deposited on the first interconnect material. A first reflow process is performed to interconnect the sphere and the VIP bond pad while the sphere remains solid, and the first reflowable material preventing the first interconnect material from migrating into the via-in-pad.
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