Compliant structure for an electronic device, method of manufacturing same, and system containing same
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United States of America Patent
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Apr 6, 2010
Grant Date -
Jun 12, 2008
app pub date -
Dec 8, 2006
filing date -
Dec 8, 2006
priority date (Note) -
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Abstract
A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.
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