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United States of America Patent

PATENT NO 7394146
APP PUB NO 20070040249A1
SERIAL NO

11589849

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

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Patent Owner(s)

  • RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.;RENESAS ELECTRONICS CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hata, Toshiyuki Maebashi, JP 83 1027
Hirashima, Toshinori Takasaki, JP 28 800
Ishii, Shigeru Tomiya-machi, JP 99 1060
Kajiwara, Ryoichi Hitachi, JP 40 911
Kishimoto, Munehisa Kamakura, JP 26 602
Koizumi, Masahiro Hitachi, JP 44 1012
Morita, Toshiaki Hitachi, JP 102 1418
Ookawa, Keiichi Takasaki, JP 13 211
Sato, Hiroshi Takasaki, JP 950 10155
Takahashi, Kazuya Hitachinaka, JP 172 2189
Takahashi, Yasushi Takasaki, JP 188 3800

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