Method of manufacturing a thick film resistor element
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United States of America Patent
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-
Dec 8, 1992
Grant Date -
N/A
app pub date -
Apr 16, 1990
filing date -
May 18, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductive paste layer of less than 5 .mu.m is formed on an insulating substrate. After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs. Resistor layers are formed corresponding to each pair of the electrodes so as to partially overlap with the electrodes.
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