Method of depositing a thick dielectric film
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United States of America Patent
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Jul 29, 2003
Grant Date -
Aug 8, 2002
app pub date -
Feb 5, 2001
filing date -
Feb 5, 2001
priority date (Note) -
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Abstract
Thick dielectric films are deposited on a substrate by building up a plurality of layers by PECVD (Plasma Enhanced Chemical Vapor Deposition) in a reactor, each layer having a thickness less than the final thickness of the film to be deposited. The reactor is cleaned between the deposition of each layer. In this way, it is possible to form high quality, optical films.
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