Computer integrated manufacturing control system for oxide chemical mechanical polishing
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United States of America Patent
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Apr 18, 2006
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app pub date -
Dec 2, 2002
filing date -
Dec 2, 2002
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Abstract
A new method is provided that extends the process of automation of the CMP process by monitoring the in-line removal rate, by using methods of curve-fitting that enable a reduction in the frequency of monitoring the removal rate of the CMP process, by enhancing the life expectancy of the polishing pad thereby further reducing the frequency of the required Preventive Maintenance and by allowing for the polishing of non-standard lots of wafers.
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