Circuit board and manufacturing method thereof
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United States of America Patent
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-
Jun 3, 2008
Grant Date -
Dec 28, 2006
app pub date -
Jun 22, 2005
filing date -
Jun 22, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one protrusion-positioning region. At least a part of the protrusion is disposed on the protrusion-positioning region. The first circuit layer is disposed on the insulating layer and has at least one trace line extending onto the protrusion.
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