Droplet jetting device and method of manufacturing pattern

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7393081
APP PUB NO 20040263564A1
SERIAL NO

10879800

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a method of manufacturing a pattern with a flattened surface and a droplet jetting device which can provides the pattern with a flattened surface. A droplet jetting means of the present invention comprises a droplet jetting means having a plurality of nozzles arranged in each row, each of the plurality of nozzles has a plurality of discharge ports aligned in an axial direction, and diameters of the discharge ports for the plurality of nozzles differ from row to row. According to one aspect of the present invention, a droplet jetting means including a plurality of nozzles arranged in two rows with a plurality of discharge ports aligned in an axial direction in each row, comprising steps of: forming a first pattern by jetting a composition through the plurality of nozzles in the first row; and forming a second pattern by selectively jetting the composition through the plurality of nozzles in the second row, wherein discharge amounts the composition jetted from each of the plurality of nozzles aligned in the first row and the second row differ from each other.

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Patent Owner(s)

  • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Keitaro Kanagawa, JP 72 1806
Maekawa, Shinji Kanagawa, JP 133 6458
Nakamura, Osamu Kanagawa, JP 481 6289

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