High density multi-layer microcoil and method for fabricating the same
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United States of America Patent
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Apr 5, 2005
Grant Date -
Nov 13, 2003
app pub date -
Jul 23, 2002
filing date -
May 10, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.
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