Method of manufacturing semiconductor device

United States of America Patent

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Jun 8, 2010
Grant Date
Dec 25, 2008
app pub date
Jun 24, 2008
filing date
Jun 25, 2007

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Expired

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Abstract

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. A copper wire may then be formed by filling the damascene pattern.

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Patent Owner(s)

DONGBU HITEK, CO., LTD.

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Jeong, Young-Seok	Gijang-gun, KR	2	15

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Method of manufacturing semiconductor device

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United States of America Patent

12145319

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PATENT NO	7732304
APP PUB NO	20080318414A1
SERIAL NO	12145319
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 08, 2010	US,7732304,B2 US7732304B2	GRANTED PATENT AS SECOND PUBLICATION
December 25, 2008	US,20080318414,A1 US20080318414A1	FIRST PUBLISHED PATENT APPLICATION

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12145319

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