Wiring line structure and method for forming the same
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United States of America Patent
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Aug 4, 2009
Grant Date -
Jan 3, 2008
app pub date -
Sep 10, 2007
filing date -
May 2, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.
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