Plating bath for electrodeposition of aluminum and plating process making use of the bath
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United States of America Patent
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Mar 6, 1990
Grant Date -
N/A
app pub date -
Apr 19, 1989
filing date -
Apr 26, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In the plating for electrodeposition of aluminum using a non-aqueous solution, a plating bath is prepared to comprise a low-melting plating bath, which comprises a molten mixture comprising an aluminum halide and a dialkyl-and/or trialkylpyridinium halide represented by the following formula: ##STR1## wherein R.sup.1 represents an alkyl group having 1 to 12 carbon atoms, R.sup.2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R.sup.3 represents an alkyl group having 1 to 6 carbon atoms, and X represents a halogen atom; and said alkyl groups each refer to a straight-chain hydrocarbon group, a branched hydrocarbon group, an alicyclic hydrocarbon group, or any of these further partly containing an aromatic hydrocarbon group, by which the bath life, operability in handling, conductivity, and current efficiency can be improved.
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