Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components
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United States of America Patent
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Sep 11, 2007
Grant Date -
Feb 9, 2006
app pub date -
Oct 3, 2005
filing date -
May 19, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for securing a semiconductor device component to another element is provided. An adhesive material includes a pressure-sensitive component and a curable component is used to at least temporarily secure the semiconductor device component and the other element to each other. The pressure-sensitive component of the adhesive material temporarily secures the semiconductor device component and the other element to one another. When the semiconductor device component and the other element are properly aligned, the curable component of the adhesive material may be cured to more permanently secure them to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200.degree. C. and as low as about 120.degree. C. or less.
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