Circuit substrate manufacturing method
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United States of America Patent
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May 29, 2007
Grant Date -
Jul 21, 2005
app pub date -
Jan 14, 2005
filing date -
Jan 19, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is formed on the metallic foil by releasing the metallic foil from the substrate, and exposing a lowest wiring layer of the build-up wiring by removing the metallic foil of the circuit member.
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