Printhead assembly having improved adhesive bond strength
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United States of America Patent
Stats
-
Sep 16, 2008
Grant Date -
Aug 31, 2006
app pub date -
Feb 28, 2005
filing date -
Feb 28, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printhead assembly is provided. The printhead assembly comprises (a) a plurality of printhead integrated circuits comprising; and (b) an ink manifold having a mounting surface, the backside of each printhead integrated circuit being bonded to the mounting surface with an adhesive. Each printhead integrated circuit comprises a plurality of nozzles formed on a front side of the printhead integrated circuit; a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and a plurality of etched trenches defined in the backside. The adhesive is received, at least partially, in the plurality of etched trenches, thereby increasing the adhesive bond strength whilst avoiding surface roughening of the printhead integrated circuits.
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