Front side hot-swap chassis management module
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United States of America Patent
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-
Feb 6, 2007
Grant Date -
Mar 31, 2005
app pub date -
Dec 29, 2003
filing date -
Sep 29, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.
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