Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor

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United States of America Patent

PATENT NO 11155730
APP PUB NO 20180258313A1
SERIAL NO

15761140

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Abstract

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The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.

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Patent Owner(s)

  • MITSUBISHI ELECTRIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hidaka, Yukio Sanda, JP 3 13
Kanri, Toshifumi Chiyoda-ku, JP 3 2
Ono, Masashi Chiyoda-ku, JP 88 908
Sano, Kosuke Sanda, JP 7 10
Tsutsumi, Takahiro Chiyoda-ku, JP 34 207
Yamamoto, Shigeyuki Chiyoda-ku, JP 36 539
Yasuda, Naoki Chiyoda-ku, JP 132 1424

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