Semiconductor sensor and manufacturing method therefor
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United States of America Patent
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Aug 10, 2010
Grant Date -
Aug 21, 2008
app pub date -
Apr 17, 2008
filing date -
Jul 6, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
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