Wafer level package with die receiving through-hole and method of the same
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United States of America Patent
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Oct 12, 2010
Grant Date -
Jul 3, 2008
app pub date -
Jan 3, 2007
filing date -
Jan 3, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
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